Amkor Technology to Build Advanced Packaging and Testing Facility in Peoria, Arizona, US

Amkor Technology has declared its plan to construct a state-of-the-art packaging and testing facility in Peoria, Arizona. In a press release, Amkor stated that the company plans to invest USD 2 billion to complete the project. The new facility will provide direct employment opportunities for 2,000 people.

The company has acquired an estimated 55 acres of land to construct the new cutting-edge manufacturing campus, which will feature over 500,000 square feet of clean room space. Amkor is the only US-headquartered OSAT (outsourced semiconductor assembly and testing) service provider with advanced packaging technology. This new facility will be the largest outsourced advanced packaging facility in the US.

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Amkor will package and test chips manufactured for Apple at the adjacent TSMC fab. Once the new facility is operational, Apple will be Amkor’s first and largest customer. Amkor has applied for CHIPS funding in order to guarantee the success of a venture of this scale in the United States. Earlier this month, the Commerce Department unveiled its plans to spend USD 3 billion on advanced packaging and manufacturing.

About Amkor Technology

Amkor Technology, Inc. is a global leader in the semiconductor packaging and test services industry. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA. Amkor has over 20,000 employees worldwide and operates semiconductor production facilities in Asia, EMEA, and the USA.

Amkor's customers include some of the world's largest semiconductor companies, such as Intel, Samsung, and Qualcomm. The company is also a supplier to a wide range of other industries, including consumer electronics, automotive, and industrial.

Here are some notable semiconductor projects undertaken by Amkor Technology:

1. Amkor's Advanced Packaging Technology Capacity Expansion in Vietnam: Amkor is expanding its advanced packaging technology capacity with a new factory in Bac Ninh, Vietnam. 

1. Amkor's Collaboration with GlobalFoundries for European Packaging Facility: Amkor has partnered with GlobalFoundries to establish a comprehensive EU/US supply chain for semiconductors. This partnership will establish the first at-scale back-end facility in Europe, enabling the production of advanced semiconductor packages in the region.

What is the CHIPS and Science Act?

The CHIPS and Science Act of 2022 is a United States federal law that provides $52.7 billion in funding for semiconductor manufacturing, research and development, and workforce training in the United States. On August 9, 2022, President Joe Biden signed the Act into law. The Act's main goals are to:

• Boost domestic semiconductor manufacturing
• Strengthen the U.S. semiconductor supply chain
• Counter China's semiconductor industry
• Foster innovation in semiconductor technology

The Act includes several key provisions, including:

• $39 billion in tax credits and other incentives to encourage American companies to build new chip manufacturing plants in the U.S.
• $11 billion for advanced semiconductor research and development, with $8.5 billion of that amount going to the National Institute for Standards and Technology, $500 million to Manufacturing USA, and $2 billion to a new public research hub called the National Semiconductor Technology Center
• $1.5 billion for workforce training programs to prepare workers for jobs in the semiconductor industry

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