Published on 20th February 2023
Texas Instruments has announced plans to invest USD 11 billion in a new 300-millimeter semiconductor wafer fabrication plant in Lehi, Utah. The plant will be adjacent to the company's existing facility and will create numerous job opportunities, contribute to the local economy, and reinforce TI's position as a leading semiconductor company in the world.
Texas Instruments Incorporated (TI), a leading semiconductor company, has revealed its plans to invest a whopping USD 11 billion to establish a new 300-millimeter semiconductor wafer fabrication plant in Lehi, Utah. The decision comes as part of TI's efforts to expand its manufacturing capabilities and meet the growing demand for advanced semiconductor technologies.
The upcoming fab will be situated adjacent to TI's existing 300-mm semiconductor wafer fab in Lehi, LFAB. Upon completion, both facilities will operate as a single unit, bolstering TI's production capabilities and enabling the company to meet the burgeoning demand for its products.
The new plant's construction is expected to create numerous job opportunities, and the facility will contribute significantly to the local economy. Additionally, the investment will bolster TI's position in the global semiconductor industry and reinforce its commitment to innovation and growth.
TI's decision to invest in a new fab highlights the growing demand for advanced semiconductor technologies in today's digitally-driven world. With this move, TI is poised to meet this demand head-on and further solidify its position as a leading semiconductor company in the world.
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