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LG Electronics Partners with Flex to Develop AI Data Center Cooling Solutions

Last Updated on Nov 04, 2025, 11:27 AM IST
LG Electronics Partners with Flex to Develop AI Data Center Cooling Solutions

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LG Electronics has signed a memorandum of understanding with Flex, a global manufacturing leader and innovator in data center infrastructure solutions, to collaborate on joint development of integrated, modular cooling solutions that address the escalating thermal management challenges of AI-era data centers. The partnership was announced on November 4, 2025, from Seoul.

Partnership Details and Technology Integration

Under the agreement, the two companies will collaborate to develop advanced cooling technologies to enhance heat dissipation in high-density data centers. The partnership combines LG's high-performance air and liquid cooling modules, including CRACs, CRAHs, chillers, coolant distribution units (CDUs), and a full suite of thermal management and monitoring solutions, with Flex's liquid cooling portfolio, proprietary power products, and IT infrastructure solutions.

This collaboration gives data center operators the agility to customize solutions and scale with demand. Co-developed solutions will be available as part of the Flex AI infrastructure platform, which is described as the first globally manufactured data center platform integrating power, cooling, compute and services into modular designs.

LG's Global Data Center Expansion

LG is actively exploring diverse opportunities to expand its data center business worldwide. In Jakarta, Indonesia, the company recently secured an AI data center project that is set to become one of the largest of its kind in the country. The company is also collaborating with DATAVOLT, a global data center infrastructure provider, on projects in the Middle East and Africa.

Additionally, LG has been awarded a contract to supply cooling solutions for a hyperscale data center under construction in North America. The company has also partnered with LG Uplus, a telecommunications provider under LG Corp., to complete a proof-of-concept demonstrating advanced liquid-cooling technology for data center thermal management.

LG is developing next-generation CDUs and cold plate solutions scheduled for completion later this year, with commercialization to follow. Building on its debut at Data Center World (DCW) in Washington, D.C., earlier this year, LG recently showcased its latest cooling technologies at DCW Asia 2025 in Singapore, further accelerating its efforts to expand its presence in the global market.

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Executive Statements and Strategic Vision

Michael Hartung, president and Chief Commercial Officer at Flex, stated: “Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data center. Together, we'll deliver prefabricated, scalable data center infrastructure solutions that incorporate advanced liquid and air cooling technologies to increase efficiency, simplify deployment and speed time to revenue for our customers.”

James Lee, president of the LG ES Company, commented: “We are advancing our competitiveness in the AI data center market by strategically partnering with leading global companies. Our collaboration with Flex adds new momentum to our global expansion and enhances our ability to deliver unique value to clients worldwide.”

Flex's Data Center Capabilities

Flex provides advanced manufacturing capabilities, innovative power and cooling products, and end-to-end lifecycle services that solve data center power, heat, and scale challenges in the AI era. The company's AI infrastructure platform integrates multiple components into modular designs, offering a comprehensive approach to data center infrastructure needs.

The partnership represents LG's strategic approach to expanding its presence in the global data center market through collaborations with established industry leaders, positioning the company to address the growing thermal management requirements of AI-era data centers.

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